ThermalFusion 400 is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.

Features
-High Thermal Conductivity.
-Low Thermal Resistance.
-Non-Curing.
-Non-Corrosive.
-Easy Application with Included Razor Blade.